Ngithi nguMicro Technology Laboratory. Ngalesikhathi, sikhombisa amasubstrates ezitwayo, isigqoko sesikrini nezingxoxo zebanga kuqwashisa ngesitimu. Kwaye ngaphandle kwesikrini, siyanikhombisa ibhodi le-wiring ye-polyimide kunye ne-lcp high-adhesion wiring board.
Bese sithi, kokunye okusetyenziselweni kwe-polyimide resin substrate, okwenzeka ukuthi uma ichaza ibhodi le-wiring ku-substrate, kuyofunakala ukuthi kusukela kubalekela kabanzi. Kunezingxoxo zokulungisa okufakiweyo, futhi lezi zikhombisa esikhundleni senhlokodolobha.
Ezi zonke zinto ezifakiweyo kunye ne-wiring board ezisenokuthatha nasezinenzekele. Kanye nezinye izinhlelo ezithunyelweyo, njengokusebenzisa imbotywana yokufaka izinkanyezi apha.
Uma uthanda akukho ukuba ngento yethu, sicela usithinte.Generated by OpenAI
iwebhusayithi:https://www.microtc.com/